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K1 (UtRAM)
K4 (DRAM)
K6 (Async Fast SRAM)
K7 (Sync SRAM)
K8 (NOR Flash)
K9 (NAND Flash)
KF (OneNAND)
KM (MOVI NAND/MCP)
M3 (DIMM)
MR (RIMM)
S3 (Microcontroller)
S5 (MOS)
S6 (DDI)
S8 (CDRAM)
DDR3 Microsite
Eco product

Technical Service

Flow & Activity

flow & activity

Feasibility Study
  • Estimate package size ( Accuracy : ~ 90%)
    • - Basic Rule : Design rule / Process Rule / Ball Count
  • Pre-Simulation (1) : Tj_max estimation, SI Design Constraint Review, Power/Ground Planning
Initial Package Design (Specification Determination)
  • Fix ball map & bump map , Define package size & Package Design( Accuracy : ~ 99%)
  • Pre-Simulation (2) : Power/Ground Planning, Delay Estimation, Thermal Simulation (Macro-Model)
Package Design (Development Stage)
  • Finalize package design for manufacturing
  • Post-Simulation : SI/PI simulation for Verification, Detail Thermal Simulation