SAMSUNG Package Roadmap
Package Thickness Roadmap
SCP (Single Chip Package)
* note : The contents above may change at any time without prior notice
- Mass production : FBGA(0.8mmt), ULGA (0.6mmt), TQFP(1.0mmt), ELP(0.5mmt), WFP(0.4mmt)
- Under Developing : FBGA(0.7mmt), XLGA(0.5mmt), XELP(0.4mmt), WFP(0.3mmt)
- WFP is the smallest and thinnest solution among all types, but we should overcome pin limitation
SIP (System In Package)
* note : The contents above may change at any time without prior notice
PoP (Package On Package)
* note : The contents above may change at any time without prior notice
- Mass production : Wire bonding FBGA/LGA PoP, Flipchip FBGA/LGA PoP
- Under Developing : IEP (IC embedded PCB package), TSV (Through Silicon Via)
- IEP PoP can use standard memory package, so can increase interconnection IO between memory and embedded ASIC pa
