SAMSUNG's TBGA (Tape BGA) is a kind of CSP (Chip Scale Package) using flexible tape substrate. Tape substrate can make fine metal line and fine finger pitch, so it is good solution for high I/O density. As it has narrow ball pitch(<0.8mm) and thin tape thickness, it can make a smaller size and thinner thickness than conventional PBGA/FBGA and be use for all mobile products - cellular phones, pagers, disk drive, laptop PC, DSC, camcorders.

• Mobile phone, pagers, disk drive, laptop PC, DSC, camcorders, notebook, Wireless system, PDA
  • - Analog, Logic, Micro controller
  • - Products requiring High ball counts and small size
  • - All mobile products

• Improving mounting space efficiency
  • - Reduction in mounting space (Standard body size : 5.0x5.0mm to 15x15mm)
  • - Reduction in mounting height (Thickness : 0.7 to 1.3mm)
  • - Reduction in package mass
• Wide ball count range : 48 to 300
• Low to medium thermal performance (1~2W)
• Reliability Level (JEDEC level 3)
• Green Products (Leadfree and halogen-free available

• TBGA has a high thermal resistance comparison to the PBGA or PBGAH becuase the single layer tape is promising in thickness but has a lower thermal conductivity than that of 2 layer or 4 layer PCB substrate.
• Thermal performance of wire bonding TBGA can be enhanced with embedding heat slug but there will be increment of package total thickness.

• For power delivery enhancement, power/ground nets can employ power/ground plane with multi-layer PCB, which gives promising solution for about 0.5nH/pad.
• Differential signal line for USB, SATA, and etc can be easily implemented with managing characteristic impedance. Typically, 100Ohm differential signal line design is available over 10 Gbps.
• The dedicated custom package design is avaiable with field solving solution and circuit simulation for any special design requiring electrical performance including xtalk management, ultra-low impedance power supply network, and skew-management.

Need dry-packing during shipping

• Moisture sensitivity characterization : JEDEC level3 (30°C/60% 192hrs , IR 260°C 3 times)
• HAST : 130°C, 85% 96hrs
• Temp. cycle : -65°C ↔ 150°C, 500 cycles
• High temp. storage : 150°C, 500hrs