SAMSUNG's FBGA (Fine Pitch BGA) is a kind of CSP (Chip Scale Package) using PCB Substrate. It is mounted on a main board through solder ball of bottom area and available in standard square or rectangular body size. As it has narrow ball pitch(<0.8mm), FBGA can make a smaller size and thinner thickness than conventional PBGA and be use for all mobile products - Processor, analog, RF, memory. FBGA gives a cost, thin & small size and high speed benefit.

• D-TV, Graphic, MPU, DSP, Projector, Workstation, Printer
  • - Analog, RF, Logic, Micro controller, DRAM, Flash devices
  • - AProducts requiring High ball counts and small size
  • - AAll mobile products

• Improving mounting space efficiency
  • - Reduction in mounting space (Standard body size : 5.0x5.0mm to 19x19mm)
  • - Reduction in mounting height (Thickness : 0.8 to 1.4mm)
  • - Reduction in package mass
• Wide ball count range : 8 to 624
• Low to medium thermal performance (1~2W)
• Reliability Level (JEDEC level 3)
• Green Products (Leadfree and halogen-free available

• General thermal characteristics are the same as PBGA but thermal resistance of FBGA is much higher than usual PBGA because of smaller die size and smaller package body size. Thermal conductivities of packaging materials are almost same.
• Center thermal ball configuration is much helpful to enhance thermal performance because heat transfer through thermal via and thermal ball can be activated with heat conduction.

• Power/Ground nets can be routed as short as possible, which gives promising solution for about 1nH/pad. Based on requirement, the multilayer PCB can be employed for enhancing power delivery.
• Differential signal line for USB, SATA, and etc can be easily implemented with managing characteristic impedance. Typically, 100Ohm differential signal line design is available over 10 Gbps.
• The dedicated custom package design is avaiable with field solving solution and circuit simulation for any special design requiring electrical performance including xtalk management.

Need dry-packing during shipping

• Moisture sensitivity characterization : JEDEC level3 (30°C/60% 192hrs , IR 260°C 3 times)
• HAST : 130°C, 85% 96hrs
• Temp. cycle : -65°C ↔ 150°C, 500 cycles
• High temp. storage : 150°C, 500hrs