SAMSUNG's HBGA (High Performance BGA) provides low profile and high-power solution among general BGAs. HBGA offers excellent thermal perfomance in a 2~4 metal-layer laminate based, cavity down BGA design. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance(inductance). HBGAs are available in a broad range of ball (I/O) counts and standard JEDEC body sizes which are supported by an industry infrastructure (sockets, trays, etc.).

• D-TV, Graphic, MPU, DSP, Projector, Workstation, Communication system
  • - Processor, graphic controller
  • - High power products

• Body size ranging from 23.0x23.0mm to 45.0x45.0mm
• Ball counts ranging from 168 to 1000
• Superior thermal performance (3~5W)
• Low profile (1.4mm mount)
• Enhanced electrical performance > 1GHz
• Green Products (Leadfree and halogen-free available)

• Excellent thermal performance with cavity down structure and heat slug.
• Highest thermal performance among wire bonding packges.

• For power delivery enhancement, power/ground nets can employ power/ground plane with multi-layer PCB, which gives promising solution for about 0.5nH/pad.
• Differential signal line for USB, SATA, and etc can be easily implemented with managing characteristic impedance. Typically, 100Ohm differential signal line design is available over 10 Gbps.
• The dedicated custom package design is avaiable with field solving solution and circuit simulation for any special design requiring electrical performance including xtalk management, ultra-low impedance power supply network, and skew-management.

Need dry-packing during shipping

• Moisture sensitivity characterization : JEDEC level3 (30°C/60% 192hrs , IR 260°C 3 times)
• HAST : 130°C, 85% 96hrs
• Temp. cycle : -65°C ↔ 150°C, 500 cycles
• High temp. storage : 150°C, 500hrs