SAMSUNG's COG(Chip On Glass) is a kind of the mounting method that IC is directly mounted on the glass panel like as COB. IC is mounted on the glass panel using gold bump and ACF. Therefore, COG provides small footprint for mobile products and low temperature mounting solution. Also COG can maximize I/O counts by the fine pitch capability of glass panel. In addition, COG provides low cost solution like as a type of COB.

• Cellular phone, Handset, PDA, 2nd TV, Monitor, Note PC
  • - Package solution for Display Driver IC
      - 1-chip solution for panel: source driver with built-in memory, gate driver,
         power IC are integrated on one chip
      - Slim and small size application

• Low cost DDI package solution
• Improving module space efficiency
  • - Reduction in module space
  • - Reduction in module height
• Simple process
• Fine pitch capability

COG's reliability specification is the same as DDI COF's

• HAST : 120°C, 85% 96hrs (in case of new product)
• Temp. cycle : -55°C ↔ 125°C, 200 cycles (in case of new product)
• High temp. storage : 125°C, 300hrs (in case of new product)

SEC have a variety of line-up of COG IC and produce.

chip short size	min 590um ~
chip long size	~ max 24,000um
chip thickness	min 20um ~
pad layout	in-line, staggered, 3-staggered
pad pitch	min 14um ~
bump height	min 10um ~
bump type	au plate bump
bump hardness	50Hv +/- 15Hv, 75Hv +/- 25Hv, 125Hv +/- 25Hv