SAMSUNG's LQFP(Low-profile Quad Flat Package) is a surface mount integrated circuit package format with component leads extending from each of the four sides. Pins are numbered counter-clockwise from the index dot. Spacing between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80 mm intervals.

TQFP, or Thin Quad Flat Package, is a type of IC packaging designed for use in space-conscious applications such as PC cards. TQFP-packaged chips are thinner than PQFP-packaged chips, with a thickness of either 1.0mm or 1.4mm.

Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t) according to JEDEC definition :

• L type: 1.2 < t <=1.7 mm
• T type: 1 < t <=1.2 mm

• Telecommunication products : Cellular phones, Wireless LAN
• Portable products : Personal computers, Personal digital assistants, Digital cameras
• Medium lead count packages : Information appliances

• LQFP/EP-LQFP Packing Offering
  • - Using standard technology and infrastructure
  • - 7x7mm to 28x28mm body size available
  • - Wide selection of pad size to meet die requirements
  • - Customized leadframe design capability
  • - 32~256 leads counts available
  • - High conductivity copper leadframes
• TQFP/EP-TQFP Packing Offering
  • - Using standard technology and infrastructure
  • - 6x6mm to 20x20mm body size available
  • - 44~176 leads counts available
  • - Fine pitch & High conductivity copper leadframes

• General thermal characteristics are the same as PBGA but thermal resistance of FBGA is much higher than usual PBGA because of smaller die size and smaller package body size. Thermal conductivities of packaging materials are almost same.
• Center thermal ball configuration is much helpful to enhance thermal performance because heat transfer through thermal via and thermal ball can be activated with heat conduction.

• Power/Ground nets can be routed as short as possible, which gives promising solution for about 1nH/pad. Based on requirement, the multilayer PCB can be employed for enhancing power delivery.
• Differential signal line for USB, SATA, and etc can be easily implemented with managing characteristic impedance. Typically, 100Ohm differential signal line design is available over 10 Gbps.
• The dedicated custom package design is avaiable with field solving solution and circuit simulation for any special design requiring electrical performance including xtalk management, ultra-low impedance power supply network, and skew-management.

• Visual inspection, Open/Short test, SAT inspection
• Temperature cycling -65°C~150°C/5 cycles ,Baking @125°C/24 hours
• Moisture soak : 30°C/60% RH/192 hours
• IR reflow : 225°C/3X 500/1000 hours