SAMSUNG's packages can be divided 4 groups(CSP, high density, high performance, module) SCP(Single in package)

• Leadframe Type (QFP, T(L)QFP, Exposed T(L)QFP, (L)QFPH, ELP)
• PCB Type (FBGA, BGA(H), (U)LGA, HBGA, FC-BGA, COG, COF)

Every type of SIP (System in package)/PoP(Package on package) is available to be provided
: Side by side & stack SIP, flip-chip PoP).

High pin & high thermal solution (~1000pin) : FC-BGA (10W), PBGAH (TEBGA, 5W), HBGA (10W)
Under developing solutions

• IEP (IC embedded PCB package) is developing for high IO interconnection with other devices
• TSV (Through Silicon Via) solution is one of future technologies and SAMSUNG is developing strongly
• TSV for CIS (CMOS image sensor) will be started mass production in this year