news
- Cadence Achieves First-Silicon Results on 32nm Common Platform Technology Jul. 29, 2009
- ARM, Chartered, IBM, SAMSUNG and Synopsys Collaborate to Deliver Vertically Optimized Solution for 32/28nm Mobile SoC Designs Jul. 27, 2009
- IBM Technology Alliance Announces Availability of Advanced 28-Nanometer, Low-Power Semiconductor Technology Apr. 16, 2009
- SAMSUNG Forms Foundry Partnership to Manufacture Advanced Programmable Logic Chips for Xilinx Feb. 02, 2009
- ARM, Chartered, IBM and SAMSUNG Collaborate to Enable Energy-Efficient 32nm and 28nm Systems-on-Chip Sep. 29, 2008
- Intel, SAMSUNG Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition -- Companies Target Common Timeline for 450mm Wafer Pilot Line Readiness May 05, 2008
- M-Led Chip Alliance Delivers Major Semiconductor Performance Leap, Power Savings Using Innovative "High-K/Metal Gate" Material Apr. 14, 2008










